Debonding of a Gel from a Rigid Substrate
Time: 2019-11-25
Published By: Xiaoni Tan
Speaker(s): Prof. Duvan Henao (Pontificia Universidad Católica de Chile)
Time: 10:00-11:00 November 25, 2019
Venue: Room 77201, Jingchunyuan 78, BICMR
A variational model for the delamination of polymer gel thin films from rigid substrates is presented. A formal asymptotic analysis of a simplified 2D version of the underlying governing equations show that, as the film grows thinner, the absorption of the moisture of its surroundings tends to produce a homogeneous vertical stretch in the part of the film that remains bonded to the substrate and a state of free swelling in the debonded part. A transition layer, with a width comparable to the film thickness, is developed in order to connect the two swelling modes. This work is joint with Carme Calderer (U. Minnesota), Carlos Garavito-Garzon (U. Minnesota), Suping Lyu (Medtronic, Inc.), and Lorenzo Tapia (PUC - Chile).
